semiconductor device engineers

Abstract: We develop an uncertainty-aware physics-informed surrogate for a one-dimensional $p$-$n$ junction diode, conditioned on device length, doping and bias. Using the internal state of the device as predicted by the surrogate we develop a test-suite of quantities of interest including the terminal current, depletion width, peak field and stored charge. The formalism and the quantities are can be extended to asymmetric junction and two-dimensional diodes as shown by means of benchmark analysis. For the one-dimensional symmetric junction surrogate, we obtain 0.11% median $L_1$ error on the electrostatic potential, and 1.5% and 0.61% on the electron and hole densities. Finally, we develop an uncertainty analysis which determines the validity of surrogate answer within the user-specified tolerance.

Abstract: High-throughput calculations using density-functional theory (DFT) are commonly used to explore point defects for applications in power electronics and quantum technologies. There is currently a major shift away from these traditional simulation techniques towards machine learning (ML) methods. We explore a class of physics-guided ML models for predicting defect formation energies and zero-phonon lines (ZPL) to identify point defects for quantum applications. The models are specifically targeted for use in a prescreening step for accelerated high-throughput workflows, and are therefore designed to avoid the costly relaxation step typically present with ML interatomic potentials (MLIPs). We compare performance for single and double point defect systems in 4H-SiC with ridge, kernel ridge, and multilayer perceptron (MLP) models using three different descriptors representing the defect systems. For vacancies and substitutions, the optimized models give mean absolute errors (MAEs) of 0.437 eV for the formation energy and 0.202 eV for ZPLs, which is just above the level at which such predictions can be useful even beyond the targeted prescreening, i.e., in some applications they may completely replace the need for costly DFT calculations. For interstitials the MAEs are larger, 1.101 eV for the formation energy and 0.230 eV for the ZPL, which, while still useful for prescreening, will not generally be useful for more detailed characterization. Hence, while the results may be further improved by model design and optimization, the models presented in this work are already useful for prescreening in high-throughput characterization of point defects.

Abstract: Experimental TCAD calibration is essential for predictive technology modeling of emerging oxide semiconductor transistors. However, it remains time-consuming and expert dependent because of model ambiguity. Multiple physical models and parameter sets can reproduce the same measured transfer characteristics, while local fitting alone cannot uniquely identify the underlying device physics. We present the first demonstration of an agentic TCAD calibration workflow for a fabricated bottom-gate In--W--O (BG-IWO) transistor. Starting from the measured transfer curve and device information, the workflow uses measurement--TCAD residuals and local sensitivity tests to select bounded parameter corrections or evaluate additional physical models, and accept only updates that improve device metrics. The LLM agent orchestrates the workflow, while Sentaurus governs the device physics. For the 2\%-W reference device, five agent-suggested updates yield a fixed calibrated model, reducing the multi-metric device objective $J$ by 14.3$\times$. Maximum $V_{\mathrm{th}}$/$I_{\mathrm{on}}$ errors are 36.1~mV/0.022 decade for varying-drain-bias tests and 46.2~mV/0.062 decade for varying-channel-length tests, demonstrating model transferability across bias and geometry rather than a local parameter fit. W-composition tests provide process-sensitive insight. This agentic workflow provides a faster route to model development for emerging device technologies.

Abstract: AI has revolutionized various engineering domains, but its impact on semiconductor device design and defect discovery is still limited, due to limited data and the curse of dimensionality. In this paper, we will discuss our work on using the Technology Computer-Aided-Design (TCAD) to generate precise data needed for machine learning (ML) to enable simulation-augmented ML. We demonstrate that with minimal domain expertise, it is possible to create a machine that performs as well as a device engineer on a specific task. We will show that auto-encoder-based machine learning models and noise engineering applied to TCAD data are effective at learning latent physics, and that the models can be seamlessly applied to experimental data. We will demonstrate how to build a device-engineer-level model step by step through various examples, including using only non-destructive electrical data to inverse-engineer the PiN diode layer thickness variations, the Ga2O3 Schottky diode doping and anode workfunction variations, and the transistor contact resistance in an inverter. Examples also include the generation of a FinFET IV/CV prediction model, the mapping between transistor images and IV curves, and the automatic calibration of TCAD parameters for a Ga2O3 Schottky diode, which can only be handled well by experienced TCAD engineers. Finally, to fully realize the potential of AI, large language models (LLMs) and multimodal LLMs (MLLMs) are believed to be necessary. We will discuss the application of LLMs to TCAD command file creation and our vision for MLLMs in automated device design and defect discovery.