Papers for

pcb designers

Papers whose findings have a practical use for this group, as judged from the abstract. Open a paper to read what it means in practice.

Routing memory bus lanes with exact crossing and layer planning

Whole-Route Planning of a Memory Bus Between Two BGAs: An Exact Model of Crossings and Layer Changes, Negotiated to DRC-Clean Copper

Abstract: Routing the bus between a processor and its DRAM remains largely manual in printed circuit board (PCB) design, and published algorithms optimize proxies such as crossing or layer counts. We present a router that plans every lane of a two-layer BGA-to-BGA bus before any copper is laid, and carries the plan to design-rule-clean copper. Its core is an exact constraint-programming model that chooses, for all lanes at once, where each necessary crossing occurs, in what order -- by a rule over every triple of lanes -- and where each lane changes layer, with via room; for the ends it is given, it proves its plan optimal within the model. The model reads naturally as physics: worldlines, frustrated Ising spins and contact forces. A linear program places the lanes in millimeters; the constraints it must violate return to the model as cuts, and audit findings as negotiated congestion prices, until the plan passes an audit against the production router's rules or lays clean. The escapes are chosen by an estimate of the same objective, and differential pairs carry their polarity, with an automatic via crossover where the ends disagree. On an Allwinner H3 and a Zynq-7020, each to a DDR3 device, the router completes every rung of two ladders, of up to 51 nets on the H3 (its whole bus) and 43 on the Zynq, connected and DRC-clean, never with more vias than the human designer (80 against 88 and 62 against 100 at the top rungs) and always with less copper, where the toolkit's production router leaves nets open on four of the ten rungs and Freerouting completes none. On the Zynq board itself it completes 45 of the bus's nets with 70 vias to the designer's 105. On generated buses of three, four and six routing layers every run completes, and every one with a known optimum attains it.

Mon 26 OctHardware Architecture
The gist
Routing the connections between a processor and its memory on a circuit board is usually done mostly by hand and is quite complex. The authors developed a planning tool that figures out the exact best paths for all the memory bus lines across two layers before any physical manufacturing, including where wires cross and switch layers. Their method uses math models inspired by physics and works by adjusting the design until it meets strict manufacturing rules. Tests on real chips show it matches or beats skilled human designers and existing tools, delivering cleaner, complete connections.
Open → 2610.35601v1

Diffusion model improves circuit board layout matching target signals

Simulator-Refined Diffusion for Radio-Frequency Inverse Design

Abstract: Diffusion models have shown potential in inverse design of printed circuit boards (PCBs), enabling the generation of layouts conditioned on target S-parameters. Despite this promise, applying diffusion models to PCB layout generation remains challenging due to their difficulty in meeting the quantitative electromagnetic specifications. A common approach is gradient-based guidance, which biases the diffusion sampling process with the gradient of an objective used for evaluation. However, full-wave electromagnetic simulators are accurate but expensive and typically non-differentiable, whereas differentiable surrogates are informative but not always reliable. To address these limitations, this paper proposes Simulator-Refined Diffusion (SRD), a novel combination of a low-fidelity differentiable surrogate and a high-fidelity non-differentiable simulator within the diffusion sampling process. Unlike standard zeroth-order optimization, which requires a great number of random perturbations, our approach uses the surrogate's gradient to propose the perturbation direction while the simulator then searches based on this direction to identify an effective design update. Experimental results across different settings show that this method consistently outperforms current state-of-the-art methods, producing layouts whose simulated S-parameters match the target specifications up to 21.2% closer for in-distribution targets and up to 19.8% for out-of-distribution targets.

Tue 29 SeptMachine LearningArtificial Intelligence
The gist
Designing circuit boards to meet specific signal goals is hard because simulations are slow or imprecise. The authors developed a new method that uses a simple model to guide the design and a detailed simulator to check the results. This combination helps create circuit board layouts that better meet the desired signal characteristics. Their method performs better than previous approaches, especially for new signal targets.
Open → 2609.38363v1

Explainable machine learning improves multilayer planar winding inductance estimation

Explainable Machine Learning for Multilayer Planar Winding Inductance Estimation

Abstract: Rapid and accurate self-inductance estimation for multilayer rectangle-shaped planar windings is essential for modern high-frequency power converters, yet traditional workflows rely on complex mathematical equations, rigid monomial formulas or unexplainable black-box machine learning (ML) models that degrade severely outside their training domain. This paper introduces an explainable ML framework unifying post-hoc feature attribution (SHAP and permutation importance) with Kolmogorov-Arnold Network-guided symbolic regression via the SR-KAN framework to discover closed-form analytical equations without prior structural assumptions. Evaluated on a new open-source dataset of over 10,000 Finite Element Analysis (FEA) simulations across seven out-of-distribution (OOD) classes, standard tree-based ensembles exhibit severe extrapolation errors (> 36%), whereas the unconstrained SR-KAN expression achieves a robust OOD relative error of 8.22%. Experimental verification across 55 physical printed circuit board prototypes (up to 8 layers, with inductances from 4.11 μH to 559.27 μH) confirms that the KAN-discovered expression translates effectively to real-world hardware, predicting inductance with a mean absolute relative error of 6.26%. To support reproducible research, the complete FEA simulation dataset and prototype measurements are released open-source.

Tue 29 SeptMachine Learning
The gist
Estimating the inductance of multilayer planar windings quickly and accurately is important for modern electronics but is usually done with complex math or black-box models that can be unreliable. The authors combine explainable machine learning techniques with symbolic regression to discover simple, interpretable formulas that predict inductance well. Tested on a large simulated dataset and real hardware prototypes, their method greatly reduces error compared to traditional approaches. They also provide their simulation data and measurements openly for others to use.
Open → 2609.37211v1