Papers for
manufacturing simulation teams
Papers whose findings have a practical use for this group, as judged from the abstract. Open a paper to read what it means in practice.
Hyperreduction speeds up discovering neural materials from experiments
Hyperreduction accelerates finite element model updating for the discovery of neural materials
Abstract: Finite element model updating is among the most general approaches to discover constitutive models from structural experiments: since the displacement field is computed rather than measured, it accommodates arbitrary geometries, boundary conditions, and sparse or noisy data. However, every loss evaluation requires a nonlinear finite element solve per load step, and training neural materials requires many such evaluations. Intrusive model order reduction lowers this cost while retaining boundary conditions and variational structure. How can a reduced model remain accurate while the network weights change at every training step? We combine proper orthogonal decomposition and energy-conserving sampling and weighting with adjoint sensitivities of the reduced model, and adapt both the trial space and the sampled elements along the optimization path. The constitutive law is a polyconvex neural network: a logarithmic normalization term, together with a zero-anchored input convex architecture and a growth term, renders the energy polyconvex, coercive, and non-negative by construction, independent of the trained weights. We demonstrate the approach on two experimental datasets and one synthetic three-dimensional example. For a two-phase specimen, training time decreases from nine hours to 41 minutes compared with a full-order identification, without loss of accuracy. In the three-dimensional example, six modes replace 48 672 degrees of freedom, 116 of 15 625 elements suffice to evaluate the internal forces, and training takes 13 minutes. In all cases, the identified material reproduces the measured reaction force and predicts the displacement field from the force alone. Hyperreduction makes the discovery of neural materials from structural data affordable while retaining the advantages of finite element model updating.
Simplified swarm optimization improves design reliability of transistor power modules
Simplified Swarm Optimization for Surrogate-Assisted Reliability Design of Insulated-Gate Bipolar Transistor Power Modules Using an Open-Source Process Finite-Element Model
Abstract: Process-induced warpage, ceramic stress and solder strain limit the reliability of insulated-gate bipolar transistor (IGBT) modules on direct-bonded copper (DBC) substrates. Surrogate-assisted design studies train regression models on finite-element analysis (FEA) databases, but rarely check the optimized designs against new FEA or report how surrogate error interacts with the optimizer. This paper builds and evaluates an open pipeline: an open-source process finite-element model, surrogates tuned by Simplified Swarm Optimization (SSO), multi-objective design search, FEA confirmation of selected designs and confirmation-driven infill. The model starts at the second reflow and reproduces measured warpage within 18.2%, 33.6% and 15.3% at the reflow, housing and molding stages without fitted parameters. On a balanced 60-design database, all stochastic tuners reach the same test accuracy, outperform the published grid on cross-validated performance for every output but generalize better only for warpage; the cross-validated ranking of tuners does not transfer to the test set. With equal result reporting, multi-objective SSO and the non-dominated sorting genetic algorithm II give comparable Pareto fronts; a corrected multi-objective particle swarm optimizer trails both. FEA confirmation shows that warpage predictions hold (mean absolute error 0.5%), whereas at the design-space bounds reached by the optimizers the ceramic-stress surrogate is optimistic by up to 26%. Two confirmation-driven infill rounds reduce this error to 1-10% and halve the out-of-sample error; no confirmed design improves on the database in ceramic stress. Ceramic-stress results are indicative, as the metric is mesh-sensitive at production resolution. The model, database, scripts and pre-registered and post-registration results are released.